ABSTRACT: After an introductory discussion of the thermal issues in stacked die packages in general, two major subjects are discussed in the paper: the qualification of die attach in stacked die structures and the questions of compact thermal modeling. An overview is given about the currently used techniques for the qualification of the die attach for failure analysis in stacked structures. The third part of the paper presents the state-of-theart and the major issues of compact thermal modeling of stacked die packages. A methodology is suggested for the transient compact modeling of stacked die structures.